Wafer-Level Reliability Test Toolkit by YEA Engineering HCI and NBTI Stress Tests

Starting at $ 995 (view pricing options)
  • Stress and measurement technique for reliability estimation
  • Test structure (MOSFET) current/voltage control and measurement in all operating regions
  • Measurement and analysis data visualization
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The Wafer-Level Reliability Test (WLR Test) Toolkit is used with National Instruments PXI Source Measure Units for semiconductor device reliability estimation at the extreme ends of the device specifications (voltage and temperature).

The toolkit accelerates device wearout and models the usable lifetime against known failure mechanisms. You can perform these tests on a wafer or a packaged level.

The WLR Test Toolkit involves techniques to stress and measure the response of the device to monitor for any signs of degradation. It provides negative bias temperature instability (NBTI) and hot-carrier injection (HCI) mechanisms for device degradation parameters estimation. All tests are designed per JEDEC standards.

Support Information
This product is supported by the third-party provider and not by NI. For more information, contact YEA Engineering at:

Website: yeae.am
Email: info@yeae.am

Disclaimer: The Third-Party Add-Ons for LabVIEW on this page are offered by independent third-party providers who are solely responsible for these products. NI has no responsibility whatsoever for the performance, product descriptions, specifications, referenced content, or any and all claims or representations of these third-party providers. NI makes no warranty whatsoever, neither express nor implied, with respect to the goods, the referenced contents, or any and all claims or representations of the third-party providers.
Part Number Description Est Ship  US Dollars Qty
787133-35YEA Engineering Wafer-Level Reliability Test Toolkit5 - 10$ 995.00

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